Library / Research & live intelligence
Source-backed work on supply chains, capacity, technology shifts, and industry structure.
7 results
A supply-chain deep dive into ASML's demand reset, memory-led EUV cycle, upstream constraints, equipment read-throughs, China exposure, and 2027 order coverage.
Micron SCA 系列第二篇，从加速器架构、模型算法与系统拓扑三个方向，压力测试 HBM 产业需求与 Micron 个体份额。收录中文 v9 与 CoWoS-L errata。
Article 3 of the Micron SCA series. Sector pass-through along the HBM value chain, organized along Article 2's three stress tests (ASIC / algorithm / topology). Draft v1: opening + Ch 2 (accelerator layer: NVDA, AMD, AVGO, MRVL). Ch 3-5 pending.
The first Micron SCA working paper: a technical audit of the contract-driven memory re-rating, HBM supply structure, and the conditions that could resolve the secular-versus-cyclical debate.
Micron dropped 32% in 12 days while posting the best quarter in company history. We dissect three fear catalysts, reconstruct actual P/E data from three historical cycle peaks, and build a verification framework for the central question: is the E about to collapse?
TSMC's advanced packaging (CoWoS) is the critical bottleneck for AI chip production. We analyze capacity expansion plans and revenue implications.
A comprehensive mapping of the AI semiconductor supply chain, identifying single points of failure and geopolitical risk concentrations.
Follow authorized earnings calls as the transcript arrives, then revisit the retained record.
Low-latency transcription, ordered corrections, and a persistent call record in one research surface.
View all calls