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Micron SCA Series — Article 3

HBM Value Chain Pass-Through: Mapping Article 2 Onto Names

Theta Research·2026-05-28·Draft v1 — Opening + Ch 2 only; Ch 3-5 pending
Betting on the industry-level geometry and betting on Micron the company are two different actions.

Article 1 established the baseline: HBM is the physical chokepoint of the AI compute stack. Article 2 stress-tested Mehrotra's SCA reframe along three vectors (ASIC, algorithm, topology) and concluded — at the industry level HBM TAM stays net-positive, but at the Micron-individual level each stress test adds a structural discount.

If you bet on Micron alone, you bet on four things going right over the next 12 months (Q3 customer prepayments / SCA counterparty / Kimi K3 token economics / Micron HBM4E + TSMC ramp). Miss any one of them and the individual re-rating shrinks.

But if you bet on the industry-level geometry — HBM TAM expanding structurally through 2026-2028 — the beneficiaries are not just Micron. They sit along the entire HBM value chain: accelerators (the ASIC wave), HBM manufacturing & packaging (including the CoWoS-L dual-chokepoint Article 2 errata flagged), network interconnect (NVL72 / UALink / CPO), and the hyperscaler customer end. Each segment has a different winners structure.

Article 3 walks that chain. For each of Article 2's three stress tests, we trace the upstream and downstream names, anchored on Theta's existing thesis library, and rank them as strong signal / medium signal / tail anchor.

The bet stops being “whether Mehrotra's SCA actually lands on Micron” — an individual question — and becomes “how many incremental beneficiaries does HBM TAM expansion create along the chain.” That is the right level of abstraction for industry-level positioning.

Premise 1

All judgments in this article assume Article 2's “industry-level net-positive” conclusion holds. If you believe Kimi Linear / Kimi K3 will cause Western frontier labs to adopt hybrid SSM in 2026-2027 and structurally compress HBM bandwidth demand, the entire chain below needs revisiting.

Premise 2

Theta's existing research is the source-of-truth here, not sell-side notes. Theta has full theses on 23 of the relevant companies; this article reorganizes them along Article 2's geometric framework.

Premise 3

No position sizing, weights, or price targets here. What we offer is “the candidate companies along the chain + each one's bet logic + each one's watch item.” Position construction is a separate exercise.

Companies This Article Will Walk Through

29 unique names · across 4 chapters · along the HBM value chain

Organized by Article 2's three stress tests + Ch 5 portfolio synthesis. Color = Theta signal tier; dashed border = alt-architecture (watch only, not a buy); top-right "uncovered" = Theta thesis pending.

Ch 2

AI Compute Chip Layer

Direct beneficiaries of the ASIC waveDrafted
NVDANVIDIA

Largest HBM consumer / industry anchor

AMDAMD

GPU #2 / MI455X 432GB HBM4 (largest per-chip)

AVGOBroadcom

Custom ASIC design partner #1 (6+ programs)

MRVLMarvell

Custom ASIC #2 + 800G/1.6T optical DSP

3661.TWAlchip

AWS Trainium 3/4 backend (displaced MRVL)

uncovered
2454.TWMediaTek

Google TPU v8 co-design (2027 volume)

uncovered
Ch 3

HBM Manufacturing & Packaging

Three-vendor supply-side battle + CoWoS-L dual-chokepoint from Article 2 errataVisuals ready · prose pending
SKHynixSK Hynix

Highest HBM4 flagship hit rate (default winner)

SamsungSamsung

AMD MI455X HBM4 primary + own Foundry backstop

MUMicron

Series protagonist — absent from nearly every HBM4 flagship

TSMTSMC

CoWoS-L sole + HBM4E base die foundry

ASMLASML

EUV lithography monopoly (most durable moat)

LRCXLam Research

DRAM etch + 3D packaging equipment

AMATApplied Materials

DRAM deposition + broadest equipment platform

KLACKLA

Process control monopoly (58% share)

AMKRAmkor

OSAT #2 / ~70% of TSMC CoWoS outsourcing

ASEASE

OSAT #1 (44.6% global) / SPIL takes 60-80K wpm TSMC CoWoS

Ch 4

Network Interconnect & Systems

NVL72 / UALink / CPO + data center power & thermalPending
AVGOBroadcom

Tomahawk 6 + Jericho routing (Ch 2 + Ch 4 dual bet)

MRVLMarvell

Teralynx switch + 1.6T LPO + Lightwave (Ch 2 + Ch 4 dual)

LITELumentum

EML laser 50-60% share

COHRCoherent

Only Western vertically-integrated optical platform (NVDA $2B invest)

VRTVertiv

Data center power + 800VDC co-dev with NVDA

ETNEaton

Power management + Boyd Thermal (DC orders +200%)

Ch 5

End Customers + Portfolio Synthesis

Hyperscaler compute consumers + alt-architecture watch listPending
GOOGAlphabet

TPU + Anthropic $200B 5yr TPU deal (strongest anti-NVDA evidence)

AMZNAmazon

AWS + Trainium 3 ($10B+ in-house ASIC)

MSFTMicrosoft

Azure $13B AI run-rate + Maia 200 + OpenAI partnership

METAMeta

$125-145B 2026 capex + MTIA + 6GW AMD

AnthropicAnthropic

Google TPU $200B anchor customer / private

OpenAIOpenAI

AMD MI450 6GW anchor + Broadcom Titan / private

CerebrasCerebras

Wafer-scale 0 HBM (alt-architecture, watch)

uncovered
GroqGroq

230MB SRAM 0 HBM (alt-architecture, watch)

uncovered
EtchedEtched

Transformer-only ASIC (alt-architecture, watch)

uncovered
StrongMediumTail anchorSeries protagonistWatch onlyTotal 31 slots · 29 unique tickers

Chapter 2

Accelerator Layer: Who's Actually Burning HBM

AI 算力芯片层:谁在烧 HBM

Mapping Article 2's ASIC stress test onto Theta's covered names

Article 2 Ch 2 concluded: the ASIC wave is net-positive for HBM TAM (it grows the pie, doesn't cannibalize it), but almost no flagship socket lands at Micron.

Flip the lens: every training-grade ASIC ramping today has a company behind it burning HBM, and the more HBM that company burns, the more it benefits at the industry level.

Accelerator-layer beneficiaries split two ways — (a) direct HBM-heavy accelerator vendors (NVDA, AMD), where each chip is itself a HBM TAM incremental driver, and (b) custom ASIC design partners (Broadcom, Marvell, Alchip, MediaTek), which don't ship HBM but collect license / NRE / production royalty — proportional to how big the ASIC wave grows.

Fig 1 · HBM Capacity Per AI Accelerator

Bars in GB. Color depth = Micron share on that socket (dark bronze = primary, dark gray = absent).

  • NVDA Rubin Ultra (2027)1,024 GB
    TBD
  • AMD MI455X (H2 2026)432 GB
    Samsung 主供 (3/18 MoU)
  • NVDA Vera Rubin VR200 (H2 2026)288 GB
    SK 主 / Samsung 次 / MU 接近零
  • Microsoft Maia 200 (2026-01)216 GB
    SK Hynix 主供
  • Meta MTIA Iris / 300 (2026)192+ GB
    SK / Samsung
  • Google TPU v7 Ironwood (2026 ramp)192 GB
    SK Hynix 主供
  • AWS Trainium 3 (2026 ramp)144-192 GB
    SK / Samsung
  • NVDA B200 (2025-2026 主力)192 GB
    SK 主 / MU 二 / Samsung 三
  • NVDA H100 (基线)80 GB
    SK Hynix 主供
Micron primaryMicron secondaryMicron tinyMicron absent
Three takeaways: (1) no chip under 80 GB — “ASIC saves HBM” is an intuitive but false premise; (2) AMD MI455X at 432 GB actually exceeds NVDA Rubin's 288 GB; (3) Micron is absent from every HBM4 flagship socket (VR200 / MI455X / TPU v7 / Maia 200 / MTIA), holding only secondary and tiny shares on prior-gen HBM3 / HBM3E.
NVDANVIDIA CorporationStrong Signal #1Theta: Buy

Largest single bet on industry-level HBM TAM — direct HBM-heavy accelerator vendor

Bet

NVDA is the most direct bet — because the company burning the most HBM is NVDA itself. It isn't passively consuming HBM as a customer; it's the designer of this HBM-concentration arms race. In the new Vera Rubin servers, every GPU carries 12 HBM4 stacks; the 2027 Rubin Ultra pushes per-package HBM capacity to 1 TB. In other words, the more NVDA ships, the more HBM SK Hynix / Samsung / Micron get pulled into selling.

The pull is already showing up on the revenue line: FY26 Q1 data center revenue $81.6B / +85% YoY; Q2 NVDA itself guided $91B; of the $1T order book, $172.6B is already locked to convert in H1. Gross margin 75% — the compound output of vertical integration + CUDA software lock + NVLink network closure, with no visible ceiling near term.

If you believe Article 2's “HBM TAM expands” conclusion holds at the industry level, you don't need to guess which HBM vendor gets the biggest slice — betting on NVDA is betting on all three HBM vendors at once, because NVDA is the force dragging them to burn.

Risk

(a) CoWoS-L 4x reticle yield pressure — TSMC pushing CoWoS to 130-150K wpm by end-2026 is unprecedented complexity (Article 2 errata flagged this); (b) whether CUDA's moat erodes under Kimi Linear and similar alternative architectures — Article 2 Ch 3 judges no material impact through 2026-2027.

Watch item

Vera Rubin actual first-ship timing (currently H2 2026 guide); CoWoS-L yield; HBM concentration ramp on NVL72 / NVL144 / NVL576.

Snapshot

Mkt Cap
$5.18T
P/E TTM
52.5×
P/E Fwd
35.0×
Rev YoY
85.0%
GM
75%
OpM
66%
Price
$212.60

Theta ScenariosPT / prob

  • Bull$390.00+83%40%
  • Base$290.00+36%50%
  • Bear$180.00-15%10%
PW PT
$319.00+50%

All three scenarios price-positive or symmetric — industry-level bet aligns with name-level bet.

thesis as of 2026-05-21

Sell-side PT
$295.69+39%

price as of 2026-05-28

yfinance one-shot, 2026-05-28

AMDAdvanced Micro DevicesStrong Signal #2 (conditional)Theta: Sell

Second direct HBM-heavy accelerator vendor — MI455X 432GB HBM4/chip is the highest single-chip HBM in this generation

Bet

AMD is the second player you can bet on directly for HBM volume, but the bet logic differs from NVDA — not “AMD beats NVDA” but “AMD is a credible second-source that gets a structural share alongside NVDA.” That's already cashing out in the 12 GW of total deals: OpenAI 6 GW + Meta 6 GW, with first ship starting H2 2026. With hyperscalers actively asking for second-source this cycle, AMD doesn't have to out-engineer NVDA to win this slice.

The more interesting twist is per-chip HBM consumption. AMD MI455X carries 432 GB HBM4 per chip — higher than NVDA Rubin's 288 GB in the same generation, only beaten by next year's Rubin Ultra 1 TB. In other words, selling one MI455X drives more HBM than selling one same-generation NVDA chip; AMD is, in this generation, the densest HBM per accelerator.

On the supply side, Samsung locked in primary HBM4 supplier status on MI455X via the AMD-Samsung MoU on 2026-03-18 — supply-chain confirmation for AMD, and precisely the Micron-individual “discount” data point Article 2 flagged. Lisa Su's positioning of MI450 as “inference-first” in May 2026 also takes half the pressure off “must beat NVDA's training stack” — 12 GW of volume, even inference-only, is a real structural bet.

One honest caveat: Theta's internal thesis downgraded AMD from bull to sell on 2026-05-11 at ~$465 (Q1 post-print +18.7% pre-market pop compressed risk-reward); current ~$495 already prices in most of the upside. So this is the “industry-level holds = AMD is a beneficiary” judgment, not the “buy AMD now” judgment — keep the two separate.

Risk

ROCm is still only 1/10 the size of CUDA by developer count; MI450 training-stack adoption at OpenAI / Meta won't be visible until Q4 2026. Theta internal thesis (2026-05-11) downgraded conviction from bull to sell around $465 — Q1 post-print +18.7% pre-market pop compressed risk-reward. This caveat needs to be on the record. Current ~$495 already prices in most of the upside.

Watch item

Evidence of MI450 training-stack >25% adoption at OpenAI / Meta; Samsung MI455X HBM4 yield (Samsung 1c currently sub-60%, target 80% by H2 2026).

Snapshot

Mkt Cap
$808.0B
P/E TTM
164.1×
P/E Fwd
38.2×
Rev YoY
37.8%
GM
53%
OpM
14%
Price
$495.54

Theta ScenariosPT / prob

  • Bull$456.00-8%25%
  • Base$304.00-39%50%
  • Bear$162.00-67%25%
PW PT
$306.00-38%

Current price above bull case; industry bet holds, but all three scenarios price negative — not a buy here.

thesis as of 2026-05-22

Sell-side PT
$472.17-5%

price as of 2026-05-28

yfinance one-shot, 2026-05-28

AVGOBroadcom Inc.Strong Signal #3Theta: Buy

ASIC wave “fan-out” beneficiary — the single biggest custom ASIC design partner

Bet

If you don't want to bet on a single accelerator, but instead on “the accelerator market fragmenting and every hyperscaler wanting its own ASIC,” AVGO is the player collecting the most design fees + royalties from that fragmentation.

Key insight: hyperscaler in-house chips (Google TPU, Meta MTIA, Microsoft Maia, AWS Trainium) don't cannibalize each other — Google won't switch to Trainium, Meta won't use Maia, each ramp is independent incremental demand. AVGO's grab isn't any one of them; it's the fact that “nearly every non-Maia hyperscaler ASIC includes AVGO's SerDes / NoC IP.” It is simultaneously inside 6+ hyperscaler ASIC programs — Google TPU (2031 long-term supply agreement), Meta MTIA (4-generation deal), OpenAI Titan (Mizuho estimate $150-200B), ByteDance, Fujitsu, Anthropic.

The revenue conversion shows the same pattern: FY26 Q2 AI semi guide $10.7B / +140% YoY, run-rate exiting the year at $42B+; Q4 FY25 backlog at $73B. That backlog curve is the most direct empirical validation of the “ASIC wave fan-out” thesis.

One-line takeaway of the two bets: NVDA earns from the GPU side; AVGO earns from “hyperscalers not wanting to use NVDA.” Both bet on the same HBM-expansion theme, but with mutually hedging risk profiles — which is why NVDA + AVGO is the classic two-name pair at the industry level.

Risk

(a) VMware renewal cliff (starting late 2026 / 2027, pricing +200-1,200% creating churn risk, though independent of AI semi revenue line); (b) NVDA Spectrum-X Photonics in 2H 2026 is an architectural challenge to AVGO CPO, but initially NVDA-only — no material impact before 2027.

Watch item

OpenAI Titan ramp progress (revenue starts 2H 2026 — the key data point for AVGO's next step); detailed contract terms of the Google TPU 2031 long-term agreement.

Snapshot

Mkt Cap
$2.00T
P/E TTM
81.9×
P/E Fwd
23.1×
Rev YoY
29.5%
GM
77%
OpM
45%
Price
$421.86

Theta ScenariosPT / prob

  • Bull$530.00+26%30%
  • Base$425.00+1%50%
  • Bear$225.00-47%20%
PW PT
$416.00-1%

Current price has essentially reached base case; Q2 FY26 print (6/3) is a binary catalyst — industry bet holds but wait for entry.

thesis as of 2026-05-22

Sell-side PT
$480.49+14%

price as of 2026-05-28

yfinance one-shot, 2026-05-28

MRVLMarvell TechnologyMedium SignalTheta: Hold

Custom ASIC #2 + optical DSP / 1.6T dual line + NVDA silicon photonics partner

Bet

MRVL is the #2 player in the ASIC wave — less diversified than AVGO, but with two distinct edges, both in places AVGO doesn't compete.

Edge #1: 800G optical DSPs. Marvell holds 70-80% global share in this market (the legacy of the 2021 Inphi acquisition), and is the first company to volume-ship 1.6T optical DSPs — all four flagship parts (Ara T / Ara X / Petra / Aquila M) on 3nm. AI data centers either use NVLink / UALink short-haul copper inside a rack, or optical interconnect for cross-rack long-haul — the latter basically can't bypass Marvell.

Edge #2: NVDA's $2B co-development agreement signed directly with MRVL on 2026-03-31, which flipped MRVL from “potential CPO substitute” to NVDA's own silicon photonics partner. Add Google's late-stage talks with MRVL in April 2026 about its own MPU + inference chip — that's MRVL's 4th hyperscaler customer locked in.

MRVL's real weakness has to be put on the table: the Trainium 3 socket has already gone to Alchip (after Trainium 2's RDL yield issues), and Alchip also won the Trainium 4 backend — meaning MRVL didn't lock in cross-generational continuity at AWS, and now has to backfill the lost share through Maia + Arke + Google MPU.

So the MRVL bet has a clear shape: more concentrated than AVGO, but each line is non-overlapping; lost AWS as a line, but NVDA silicon photonics + Google MPU are filling in. It's the “concentrated but clearly diversified-by-line” bet within the ASIC wave.

Risk

Trainium 3 socket already lost to Alchip (post Trainium 2 RDL issues), Alchip also won Trainium 4 backend — MRVL is not inter-generationally locked in at AWS. AWS still ~76% of data center revenue. ~$199 already reflects NVDA partnership + hyperscaler expansion — no margin of safety.

Watch item

Revenue ramp on Maia 200 + Arke + Google MPU; speed of backfill from the Trainium loss.

Snapshot

Mkt Cap
$174.0B
P/E TTM
64.9×
P/E Fwd
35.9×
Rev YoY
22.1%
GM
51%
OpM
19%
Price
$198.70

Theta ScenariosPT / prob

  • Bull$260.00+31%30%
  • Base$210.00+6%50%
  • Bear$115.00-42%20%
PW PT
$206.00+4%

Current price near base case; NVDA silicon photonics + Google MPU defend bull, Trainium loss anchors bear.

thesis as of 2026-05-22

Sell-side PT
$162.03-18%

price as of 2026-05-28

yfinance one-shot, 2026-05-28

Fig 2 · Theta PW Upside Across Names

Probability-weighted target vs current price, expressed as implied upside. 0% is current price baseline.

  • NVDA
    +50%
  • MRVL
    +4%
  • AVGO
    -1%
  • AMD
    -38%
−60%0%+60%
NVDA is the only name with materially positive PW upside — industry and name bets both hold. AMD's −38% says: the industry-level bet is real (HBM-heavy, genuine second-source dynamic), but current price has overshot Theta's bull case — “buy here” doesn't hold. AVGO at base case, MRVL slightly positive — industry bets hold, but the asymmetric upside has been largely earned.

Fig 3 · Accelerator → HBM Vendor Supply Flow

Line width = supply share (thick = primary, medium = secondary, thin = tiny). The Micron column is barely visible — because Micron is absent from every HBM4 flagship socket.

AcceleratorHBM vendorNVDA Rubin UltraAMD MI455XNVDA Vera Rubin VR200Microsoft Maia 200Google TPU v7NVDA B200SK HynixSamsungMicron
Primary Secondary Tiny
This is the most direct visual evidence of Article 2 Ch 2's “Micron is absent from every HBM4-era flagship socket” claim — the Micron column receives only a single secondary line from NVDA B200. The other five flagship sockets all flow into SK Hynix / Samsung.

Tail anchors — two Taiwan names Theta does not yet cover

Two more names benefit from the ASIC wave at the industry level, but Theta does not yet have formal thesis coverage:

Alchip (3661.TW) — AWS Trainium 3 / 4 backend design (displaced MRVL), taking share away from MRVL. One of the real beneficiaries of the AWS in-house chip wave.

MediaTek (2454.TW) — Google TPU v8 co-design (volume 2027), competing with the AVGO platform for Google's next ASIC generation.

Theta will queue light-touch thesis coverage on both. For now they sit as tail anchors in the industry-level portfolio — high potential, but coverage isn't complete yet, so not promoted to strong / medium signal tiers.

Chapter Verdict

The accelerator-layer beneficiary list is clear. Returning to Article 2 Ch 2's framework: the direct beneficiaries of the ASIC wave growing HBM TAM are NVDA + AMD + AVGO + MRVL + (Alchip + MediaTek) — six names total. The first four already have full Theta theses; the last two are queued for coverage.

If you bet on the industry-level conclusion holding, NVDA + AVGO are the first choice (most diversified, most direct); AMD + MRVL second (more concentrated, but each carries a distinct edge — single-chip HBM capacity for AMD, design-partner dual lines for MRVL).

Micron — the series protagonist — does not appear in this chapter. Because Article 2 Ch 2 already concluded Micron is absent from nearly every HBM4-era flagship socket, there is no structural bet on Micron at the accelerator layer. This is the first concrete instance of “betting industry-level ≠ betting Micron.”

Next chapter: the HBM manufacturing and packaging chain — the actual three-vendor (SK / Samsung / MU) supply-side battleground, plus the Article 2 errata's CoWoS-L dual-chokepoint (TSM gets weighted up here) and the AMKR / ASE OSAT overflow that Article 2 didn't cover.

Fig 4 · AI Compute Chip Ego View (center = NVDA)

Visual coda for Article 3's geometric claim — “the industry-level winner set is 5-7 names, not 1.” Color = role; line = business relationship.

Second-source GPUASIC 设计 (6+ 程序)ASIC 设计 + 1.6T 光 DSPTrainium 3/4 后端Google TPU v8 协同N3 + CoWoS-L 独家AMDAVGOMRVLAlchipMediaTekTSMNVDAIndustry anchor
GPU peerASIC design partnerASIC backend (tail)Upstream foundry
This view answers the opening line: betting on HBM TAM expansion = betting on NVDA + AMD + AVGO + MRVL + (Alchip / MediaTek tail) + the shared TSM upstream — 7 nodes, not just NVDA, and not just Micron. The remaining chapters (HBM manufacturing, network interconnect, hyperscaler endpoints) each get their own ego view.

Ch 3 Preview · HBM Vendor Ecosystems

SK Hynix / Samsung / Micron — Three Ego Views

Chapter 3 (HBM Manufacturing & Packaging) text is still pending, but the visuals come first — three ego views, one per HBM vendor, mapping each one's customers, equipment suppliers, upstream foundry, and competitors. Stacked side-by-side, Micron's structural absence from HBM4-era flagship customers stands out against the SK Hynix / Samsung pattern.

HBM vendor #1

SK Hynix — Highest hit rate on HBM4 flagship sockets

~70% of NVDA Vera Rubin HBM4 allocation, Maia 200 sole, TPU v7 primary — the default winner of HBM4.

Ring 1Ring 2GM 49%GM 49%GM 53%GM 49%GM 62%GM 50%GM 45%GM 49%GM 60%GM 49%GM 49%GM 49%GM 49%GM 39%SKHynixAMAT▲ supplierASML▲ supplierKLAC▲ supplierLRCX▲ supplierTSM▲ supplierTRUMPFZEISSAAPL▼ customerAMD▼ customerGOOG▼ customerMSFT▼ customerNVDA▼ customerMETAORCLMU◆ competitorSamsung◆ competitorUPSTREAMDOWNSTREAMPEERS
Gross Margin
0%50%100%
LowMidHigh
Edge Quality
Core
Soft
Contextual

Hover for relationships · Click for company page

HBM vendor #2

Samsung — Reclaims HBM4 seat via AMD MI455X, base die backstopped by own Foundry

AMD-Samsung MoU 2026-03-18 wins MI455X primary + ~30% Vera Rubin allocation + own Foundry 4nm logic base die — the only HBM4E path not dependent on TSMC.

Ring 1Ring 2GM 47%GM 49%GM 53%GM 39%GM 62%GM 50%GM 45%GM 39%GM 55%GM 49%GM 39%GM 39%GM 39%GM 39%GM 39%SamsungAMAT▲ supplierASML▲ supplierKLAC▲ supplierLRCX▲ supplierQCOM◈ bothTRUMPFZEISSAAPL▼ customerAMD▼ customerGOOG▼ customerNVDA▼ customerMETAMSFTORCLMU◆ competitorSKHynix◆ competitorUPSTREAMDOWNSTREAMPEERS
Gross Margin
0%50%100%
LowMidHigh
Edge Quality
Core
Soft
Contextual

Hover for relationships · Click for company page

HBM vendor #3 (series protagonist)

Micron — Series protagonist: absent from every HBM4 flagship, ceding HBM4E base die to TSMC

Near-zero share on NVDA Vera Rubin, displaced from AMD MI455X by Samsung, unlisted on TPU v7 / Maia 200 / MTIA — structurally marginalized in HBM4. HBM4E further cedes base-die value to TSMC.

Ring 1Ring 2Equipment for DRAM.. | GM 50%GM 45%GM 49%GM 45%GM 53%GM 45%GM 62%GM 45%GM 45%GM 45%GM 45%GM 45%GM 60%GM 49%GM 39%MULRCX▲ supplierAMAT▲ supplierASML▲ supplierKLAC▲ supplierTSM▲ supplierTRUMPFZEISSAAPL▼ customerAMD▼ customerDELL▼ customerMETA▼ customerMSFT▼ customerNVDA▼ customerORCLSKHynix◆ competitorSamsung◆ competitorUPSTREAMDOWNSTREAMPEERS
Gross Margin
0%50%100%
LowMidHigh
Edge Quality
Core
Soft
Contextual

Hover for relationships · Click for company page

Ch 3 prose + Ch 4 / Ch 5 pending

Ch 3 — HBM Manufacturing & Packaging (brief cards + prose): SK Hynix / Samsung / MU / TSM (CoWoS-L) / LRCX / AMAT / ASML / KLAC / AMKR / ASE

Ch 4 — Network interconnect & systems · Ch 5 — End customers + portfolio + watch list

Micron SCA series: Article 1 published · Article 2 full + errata · Article 3 draft v1.